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Shownotes
New episode: Advanced packaging for AI chips, from wire bonds to TSMC CoWOS and Intel EMIB.
Packaging is no longer an afterthought. It is the chip, and Intel's EMIB challenges TSMC's CoWOS.
• Three CoWOS flavors: silicon, organic RDL, local bridges
• EMIB embeds tiny bridges into the substrate, no interposer
• EMIB-T and EMIB-M add through-silicon vias and power capacitors
• Google is booking 3M TPUs on EMIB via MediaTek by 2028
• Package sizes keep climbing: 5.5x reticle today, 40x ahead
This episode is brought to you by SambaNova. Try SambaNova's fast inference today at the SambaNova Dashboard (fandf.co/4etZbvP)!
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Chapters:
() "There Is No Chip Without the Packaging"
() Intro and SpaceX IPO Day
() What We're Covering: CoWOS, EMIB, Google
() Simple Packaging: Wire Bonds to Flip Chip
() What Makes Packaging "Advanced"
() CoWOS: Three Flavors Explained
() EMIB: Intel's Embedded Bridge Approach
() EMIB-T and EMIB-M
() CoWOS vs. EMIB Trade-offs
() Google's 3M TPU EMIB Order
