Ep. 003 - Deep Dive on NVIDIA Vera Rubin VR NVL72 (AI Supply Chain) | Jordan Nanos, Myron Xie, Copper Wei (Wega), Howie

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00:00 (youtube.com/watch?v=_KVy7ADopQA) Introduction to Vera Rubin and Extreme Co-Design
02:30 (youtube.com/watch?v=_KVy7ADopQA&t=150s) Innovations in GPU Architecture: From Blackwell to Rubin
05:38 (youtube.com/watch?v=_KVy7ADopQA&t=338s) Memory Bandwidth and HBM4: A New Era
08:26 (youtube.com/watch?v=_KVy7ADopQA&t=506s) NVLink 6 and Interconnect Enhancements
11:38 (youtube.com/watch?v=_KVy7ADopQA&t=698s) Cable-less Design: Revolutionizing System Assembly
14:29 (youtube.com/watch?v=_KVy7ADopQA&t=869s) Thermal Management Innovations in Rubin
17:30 (youtube.com/watch?v=_KVy7ADopQA&t=1050s) Power Management and Performance Expectations
33:36 (youtube.com/watch?v=_KVy7ADopQA&t=2016s) Innovations in Packaging and Heat Management
38:15 (youtube.com/watch?v=_KVy7ADopQA&t=2295s) Chiller-less Design and Data Center Infrastructure
40:47 (youtube.com/watch?v=_KVy7ADopQA&t=2447s) Power Delivery Innovations in Rubin
46:16 (youtube.com/watch?v=_KVy7ADopQA&t=2776s) Memory Solutions and Supply Chain Management
54:57 (youtube.com/watch?v=_KVy7ADopQA&t=3297s) Deployment Timeline and Future Expectations